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Electronic Pulp Product Classification
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Electronic Pulp Product List
Part NumberSmall ClassificationSolid contentviscosityFinenessProduct Category Full NameDatasheet
E-2369EH Palladium Silver Internal Electrode Paste For Chip 52.5±1.0% 52.5±1.0 25.0~31.0 ≤6.0μm/5.0μm
E-2160H Palladium Silver Internal Electrode Paste For Chip 60.0±1.0% 60.0±1.0 18.0~24.0 ≤6.0μm/5.0μm
E-2360BT Palladium Silver Internal Electrode Paste For Chip 60.0±0.5% 60.0±0.5 16.0~19.0 ≤6.0μm/5.0μm
E-20260 Palladium Silver Internal Electrode Paste For Chip 64.5±1.0% 64.5±1.0 30.0~40.0 ≤6.0μm/5.0μm
E-2160S Palladium Silver Internal Electrode Paste For Chip 60.0±1.0% 60.0±1.0 12.0~14.0 ≤6.0μm/5.0μm
E-20563 Palladium Silver Internal Electrode Paste For Chip 63.0±1.0% 62.5±1.0 23.0~29.0 ≤6.0μm/5.0μm
E-2160DG Palladium Silver Internal Electrode Paste For Chip 60.0±1.0% 60.0±1.0 12.0~16.0 ≤6.0μm/5.0μm
E-2369BT Palladium Silver Internal Electrode Paste For Chip 60.0±0.5% 60.0±0.5 15.5~18.5 ≤6.0μm/5.0μm
E-20560 Palladium Silver Internal Electrode Paste For Chip 60.0±1.0% 60.0±1.0 10.0~25.0 ≤6.0μm/5.0μm
E-2369ET Palladium Silver Internal Electrode Paste For Chip 52.5±1.0% 52.5±1.0 12.5~14.5 ≤6.0μm/5.0μm
E-2246 Palladium Silver Internal Electrode Paste For Chip 51.0±1.0% 51.0±1.0 10.0~12.0 ≤6.0μm/5.0μm
E-1150LT Palladium Silver Internal Electrode Paste For Chip 54.0±1.5% 10.0~30.0Pa.s ≤6.0um/5.0um Electronic Paste
E-1150DG Palladium Silver Internal Electrode Paste For Chip 54.0±1.5% 10.0~30.0Pa.s ≤6.0um/5.0um Electronic Paste
E-1150 Palladium Silver Internal Electrode Paste For Chip 54.0±1.5% 54.0±1.5 10.0~30.0 ≤6.0μm/5.0μm
E-2255 Palladium Silver Internal Electrode Paste For Chip 55.0±1.0% 55.0±1.0 12.0~15.0 ≤6.0μm/5.0μm
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